Application Notes To read a brief synopsis of the application notes we have available, please click on the links below. If, after reading the synopsis, you wish to request the full document, simply click on the download link and fill out the request form.* A full-length copy will be sent to your e-mail address. Application Note: 111 Endpointing the Via Oxide Etch on the TEL Unity DRM Using OES Application Note: 112 Endpointing the CHF3/CF4/Ar Plasma Oxide Etch with Spectral Analysis Application Note: 113 CHF3/CF4/Ar Plasma Oxide & Nitride Etch with Spectral & Chemical Analysis Application Note: 114 OES Interferometric Effects During Plasma Etching Application Note: 115 Photoresist Ashing Endpoint by Optical Emission Spectroscopy (OES) Application Note: 116 Endpointing NF3 Chamber Clean by OES before a Trench Etch Application Note: 117 Endpointing NF3 Chamber Clean by Optical Emission Spectroscopy *You are under no obligation and no salesperson will contact you unless you wish it. We do not sell or trade any information we receive.